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Finally, rework procedures must be examined and controlled more strictly in lead-free applications Control of the rework temperature and time that the PCB is exposed to this temperature is critical Since rework involves local heating of a specific area of the PCB, the issue of temperature gradients can be even more severe For all of these reasons, it is strongly recommended that manufacturers perform studies to assess compatibility among the base material, the PCB fabrication process, and the assembly process First article qualifications when transitioning specific PCB designs to lead-free assembly are strongly recommended Success with one PCB design does not necessarily mean that other designs can use the same material or fabrication process successfully In short, leadfree assembly processes are significantly more demanding on the PCB and base materials used and require extensive engineering work to validate compatibility with the assembly process and the requirements for long-term reliability..

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11.3 SELECTING THE RIGHT BASE MATERIAL FOR SPECIFIC APPLICATIONS 2,3

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A very common request from PCB fabricators, electronic manufacturing services (EMS) companies, and OEMs is whether a given material is compatible with lead-free assembly. Although everyone is looking for a simple answer, the solution becomes complex because of the range of PCB designs (board thicknesses, layer counts, aspect ratios, via pitch, and so on) as well as the differences in lead-free assembly processes, such as the specific peak temperature and number of thermal cycles a PCB will experience. Previous sections also outlined how the PCB fabrication process and assembly process can influence compatibility. In addition, people usually want to use the least expensive material that is suitable for a given application. So although it is easy to specify an advanced product for lead-free compatibility, the approach taken here is to balance cost and performance. In an attempt to simplify this discussion, this section describes a material selection tool that has been developed to suggest what materials should be considered for a given application. This tool is based on data such as that presented in Chap. 10, in the references, as well as empirical results from prototype and production experience with lead-free assembly applications. The experience of several people with hundreds of years of combined experience has been leveraged in designing these tools. However, no such tool can address every specific application with 100 percent confidence. In addition, the capabilities of various PCB fabrication

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The basic commands of this format include:

Selecting the aperture Opening and closing the aperture shutter Moving the head to a given x, y coordinate

Typically, commands are separated by the asterisk character (*).3 18.3.2.1.2 Gerber 274X. Gerber RS-274-X is a common format in use today for describing PCB plot data. The format can be divided into two parts:

The Gerber part The extended part, which includes commands for the following:

Typically, extended commands begin with % and end with *%. Unlike Gerber 274D format, Gerber 274X includes definition of coordinates using the FS command (see Fig. 18.10). Reading software uses this information when reading Gerber parts. The most serious limitation of Gerber 274X is polygon representation. No solution was provided for describing internal cutouts or clearances. Each implementation of Gerber 274Xbased CAD output deals with these in its own way. The most problematic way is to use selfintersecting polygons (SIPs) where the pen does not leave the board while drawing the internal cutouts, but swerves to the inside of the external outline to draw the internal cutout and then returns (see Fig. 18.11).

Example %FSLAX23Y23*% %MOIN*% %SFA1.000B1.000*% %ADD11C,0.00500*% %ADD13C,0.00800*% %ADD14C,0.01000*% %ADD70C,0.02000*% %ADD71C,0.02500*% G54D11* %LPD*% Here the Gerber part begins. This command indicates that digitized data is dark. However, when the entire film is reversed, the digitized data will be clear. These are aperture definition commands defining various diameter circles (5, 8, 10, 20, and 25 mil, respectively) This command indicates (L)eading zero suppression,(A)bsolute, 2.3, or xx.xxx and yy.yyy decimal point location This command specifies inches

G11*G70*G01*D02*G54D10*X-0020000Y-0250000D02*X-0020000Y-0265200D01* X0010000Y-0255000D02*X0010000Y-0250000D01*X0025200Y-0344800D02* X0025200Y-0285000D01*X0022800Y-0265200D02*X0022800Y-0270000D01* This is straight Gerber code with multiple commands on a line.

It is easy to see that if the components of the metric are constant, all of the Christoffel symbols vanish. Note that the Christoffel symbols of the rst kind are symmetric in their rst two indices:

1. b 2. a 3. b* 4. d 5. b *Two checks are generally enough, but if you run into problems, you may need more test sessions.

An SIP is a polygon with two nonconsecutive edges (segments or curves) touching each other. SIPs are illegal in CAM systems that define legal polygons as those whose edges intersect only at endpoints of consecutive edges. Translation of 274X data into a CAM system might fail with a Self Intersecting Polygon error because some CAD systems create surfaces using self-intersecting polygons. SIPs are not mathematically robust, and the following SIP operations are problematic:

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